China’s Big Fund Phase III opens with Piotech Jianke investment in hybrid bonding technology

China's Big Fund Phase III opens with Piotech Jianke investment in hybrid bonding technology

Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx. US$350 million) pre-investment valuation, seeking to raise as much as…



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