Exclusive | Hong Kong tech park tender targets strong bidders with HK$100m bond rule
Winning consortiums bidding for core land parcels at an innovation hub near Hong Kong’s border must post a HK$100 million (US$12.7 million) construction bond and meet a tight 30-month development deadline, according to tender documents obtained by the South China Morning Post. Industry leaders said the requirements, which deviated from those in conventional government land…