
Japan says $550 billion package in trade deal could finance Taiwanese chipmaker in US
By Makiko Yamazaki TOKYO (Reuters) -Japan’s $550 billion investment package agreed in this week’s U.S. tariff deal could help finance a Taiwanese firm building semiconductor plants in the U.S., Japan’s top trade negotiator Ryosei Akazawa said on Saturday. Japan agreed to the sweeping U.S.-bound investment initiative, which includes equity, loans and guarantees, in exchange for…