TAIPEI/BEIJING — When a team of Huawei engineers arrived in Jiangyin two years ago, they had an urgent mission: turn little-known supplier SJ Semiconductor into a competitive player in chip packaging and stacking technologies.
Chip packaging is becoming almost as important as chip manufacturing itself in the race to build ever more powerful AI semiconductors. Taiwan Semiconductor Manufacturing Co.’s CoWoS packaging is the gold standard in the industry, used by Nvidia, Amazon and all other top chip designers for their AI offerings.
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