Dry Film Photoresist Market Set to Surge with 5G, EV,

Dry Film Photoresist Market Set to Surge with 5G, EV,

Global Market Driven by PCB Demand, Automation, and Sustainability Trends:

The Dry Film Photoresist (DFPR) Market is expanding rapidly, supported by surging demand for miniaturized PCBs in consumer electronics, EVs, and 5G infrastructure. With Asia-Pacific leading production and consumption, the market is shaped by innovations in photolithography, automation, and eco-friendly formulations.

❓ What Is the Market Size of the Dry Film Photoresist Market?

In 2024, the global market size of Dry Film Photoresist was estimated to be worth US$ 939 million and is forecast to reach approximately US$ 1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.

Source: https://reports.valuates.com/market-reports/QYRE-Auto-12W548/global-dry-fotoresist

❓ What Is Driving the Growth of the Dry Film Photoresist Market?

🔹 Major Growth Factors

• 📦 Increased demand for advanced packaging and printed circuit boards (PCBs)

• 📏 Need for high-resolution patterning in compact electronic devices

• 🌱 Preference for low-waste dry film technology over liquid alternatives

• ⚙️ Adoption of automation in PCB fabrication, improving efficiency and consistency

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🧮 How Is the Market Segmented?

🔹 By Type

• Standard Dry Film

• Photoimageable Solder Resist

• Others

🔹 By Application

• PCB Fabrication (Rigid, Flexible, HDI)

• IC Packaging & Substrates

• Lead Frame / Chemical Milling

• Automotive Electronics

🔹 By Region

• Asia Pacific – 73%

• Americas – 17%

• Europe – 8%

👥 Who Are the Top Players in the Dry Film Photoresist Market?

• Asahi Kasei

• Eternal

• Showa Denko Materials

• 🔹 Top 3 players hold ~80% global market share

• 🔹 Japan leads global production with >55% share

• 🔹 Taiwan and U.S. follow in volume

• 🔹 Asia-Pacific is the largest consumer market

🧾 What Is the Role of Dry Film Photoresist in the Industry?

Dry film photoresists are essential in image transfer processes for:

• PCB fabrication (Rigid, Flexible, HDI)

• IC packaging and substrates

• Chemical milling and lead frames

• Automotive and LED electronics

Its superior adhesion, high pattern resolution, and low waste output make it a preferred photolithography solution in both traditional and emerging applications.

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This release was published on openPR.

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